3D Integration for NoC-based SoC Architectures by Chuan Seng Tan (auth.), Abbas Sheibanyrad, Frédéric Pétrot, PDF

By Chuan Seng Tan (auth.), Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch (eds.)

ISBN-10: 1441976175

ISBN-13: 9781441976178

Back hide replica sequence: built-in Circuits and platforms 3D-Integration for NoC-based SoC Architectures by way of: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This e-book investigates at the grants, demanding situations, and ideas for the 3D Integration (vertically stacking) of embedded structures attached through a community on a chip. It covers the total architectural layout technique for 3D-SoCs. 3D-Integration applied sciences, 3D-Design concepts, and 3D-Architectures have emerged as issues serious for present R&D resulting in a wide variety of goods. This e-book offers a entire, system-level evaluation of third-dimensional architectures and micro-architectures. •Presents a accomplished, system-level assessment of third-dimensional architectures and micro-architectures; •Covers the total architectural layout process for 3D-SoCs; •Includes state of the art therapy of 3D-Integration applied sciences, 3D-Design recommendations, and 3D-Architectures.

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F. Ang, J. M. S. Tan, Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation. IEEE International Conference on 3D System Integration, art. no. 5306545, 2009. 41. F. G. F. Ang, J. M. S. Tan, Application of Self Assembly Monolayer (SAM) in Cu–Cu Bonding Enhancement at Low Temperature for 3-D Integration, Advanced Metallization Conference, Baltimore, October 13–15, 2009. C. E. Schulz (Eds), AMC 2009, pp. 259–266, ISBN 978-1-60511-218-3, Materials Research Society, 2010.

9a gives the maximum performance under a given power budget. 4 times higher performance per Watt than a 2-D topology. Interestingly, for every doubling of the stack height, we see a 20–30% increase of the performance per Watt figure. 9a. The somewhat higher ECE of 3-D topologies are obtainable at significantly lower frequency and smaller area. 5 GOPS). For any given area, the frequency required for a 2D topology is about 25 times the frequency of the 3D16 system. Since frequencies above a few GHz are hard and costly to realize, a 2-D chip faces a tough performance hurdle while 3-D topologies can approach their ECE limits at much lower frequencies.

We have matched the DRAM generation to the technology node, such that 180€nm corresponds to SDRAM and 17€nm to DDR3. There are a number of complexities 36 A. Jantsch et al. associated with off-chip transactions, such as bus controller architecture, termination power, transaction delay, and the number of peripheral I/O devices, which cause the energy to vary over a wide range depending on these choices. In our study we have been consistent with the values we use in order to minimize the impact on comparisons between different schemes.

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3D Integration for NoC-based SoC Architectures by Chuan Seng Tan (auth.), Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch (eds.)

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